CVE-2023-28561

{"cve": {"data_type": "CVE", "references": {"reference_data": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin", "name": "https://www.qualcomm.com/company/product-security/bulletins/august-2023-bulletin", "tags": ["Vendor Advisory"], "refsource": "MISC"}]}, "data_format": "MITRE", "description": {"description_data": [{"lang": "en", "value": "Memory corruption in QESL while processing payload from external ESL device to firmware."}]}, "problemtype": {"problemtype_data": [{"description": [{"lang": "en", "value": "CWE-787"}]}]}, "data_version": "4.0", "CVE_data_meta": {"ID": "CVE-2023-28561", "ASSIGNER": "security.cna@qualcomm.com"}}, "impact": {"baseMetricV3": {"cvssV3": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 9.8, "attackVector": "NETWORK", "baseSeverity": "CRITICAL", "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 3.9}}, "publishedDate": "2023-08-08T10:15Z", "configurations": {"nodes": [{"children": [{"children": [], "operator": "OR", "cpe_match": [{"cpe23Uri": "cpe:2.3:o:qualcomm:qcn7606_firmware:-:*:*:*:*:*:*:*", "cpe_name": [], "vulnerable": true}]}, {"children": [], "operator": "OR", "cpe_match": [{"cpe23Uri": "cpe:2.3:h:qualcomm:qcn7606:-:*:*:*:*:*:*:*", "cpe_name": [], "vulnerable": false}]}], "operator": "AND", "cpe_match": []}], "CVE_data_version": "4.0"}, "lastModifiedDate": "2023-08-10T18:17Z"}